;Fa'atuatuaina Maualuga;
1.Robust mamanu mo le vibration teteʻe ma le vevela tele faapalepale (-25 ° C i le + 85 ° C).
2.Gold-plated fesoʻotaʻiga faʻamautinoa le maualalo o le teteʻe ma le mautu o le conductivity.
;Ma'oti & Mama;
1.1.5mm pitch wafer design sefe le avanoa, lelei mo faʻapipiʻi faʻapipiʻi i totonu o faʻamalama o le taʻavale.
2.Lightweight fausiaina (mamafa: ≤0.5g i le faʻafesoʻotaʻi).
;Faigofie Fa'atasi;
1.Plug-and-play design with color-coded terminals mo le fa'apotopoto vave.
2. Faʻatasi ma faiga masani SMT / LD.
;Tusipasi;
1.IATF 16949 (Pule o Tulaga Lelei mo Alamanuia tau Taavale)
2.ISO 9001/14001
;Parameter; | ;Taua; |
;Pitch; | 1.5mm (±0.1mm faapalepale) |
;Numera o Feso'ota'iga; | 2–10 tulaga (fa'atonu) |
;Fuafuaga o le Volta; | 100V DC / 12V AC |
;Fa'ailoga o lo'o iai nei; | 2A mo le faʻafesoʻotaʻi |
;Galulue Vevela | -40°C i le +125°C |
;Ituaiga Fa'amuta; | IDC (Feso'ota'i Su'ega Insulation) |
;Lagolago Uea Uea; | 2.0A(24 AWG) 1.5A (26 AWG) 1.0A(28 AWG) |
Tu'u Aofa'iga Aofa'iga | 800/reel |
;mamafa; | 0.3–0.8g i le so'oga |
;Tusipasi; | IATF 16949, ISO9001 14001 |
●Faiga moli o Taavale: Molī ulu, Molī puao, Molī Si'usi'u, Module moli totonu.
●Tagata fa'aoga sini: OEM Ta'avale, Fa'atau oloa Tier-1, Fa'amea Fa'atauga Fa'atau.
●Tausi a le lalolagi: Faʻafeiloaʻi tulaga faʻapitoa taʻavale (ISO, IATF, ).
●Tau-Tagata: Tau fa'atauvaga FOB/EXW fa'atasi ma le MOQ maualalo
●Vave Tiliva: Lagolago DDP felauaiga i nofoaga i le lalolagi atoa i totonu ole 15–30 aso.
●Lagolago ina ua uma ona faatau atu: 24/7 fesoasoani fa'apitoa
1. Fa'apipi'i i totonu o se fa'apotopotoga moli o le ta'avale.
2.Certification igoa (UL, IATF, ma isi).